{pboot:if('

Application Scenarios:Suitable for wrapping, flat lamination, and edge banding of wall panels made from materials such as Stone-Plas  tic Composite (SPC), 

Wood-Plastic Composite (WPC), Aluminum-Plastic Composite (APC), and Eco-wood

Product characteristics:

1.Fast positioning, excellent penetration, high bonding strength, and wide substrate compatibility

2.Strong initial tack, excellent workability

'=='')}Application Scenarios:Suitable for wrapping, flat lamination, and edge banding of wall panels made from materials such as Stone-Plas tic Composite (SPC), Wood-Plastic Composite (WPC), Aluminum-Plastic Composite (APC), and Eco-wood{else}

Application Scenarios:Suitable for wrapping, flat lamination, and edge banding of wall panels made from materials such as Stone-Plas  tic Composite (SPC), 

Wood-Plastic Composite (WPC), Aluminum-Plastic Composite (APC), and Eco-wood

Product characteristics:

1.Fast positioning, excellent penetration, high bonding strength, and wide substrate compatibility

2.Strong initial tack, excellent workability

{/pboot:if}

Application Scenarios:Suitable for bonding various PVC sheets/rolls for flooring installation

Product characteristics:

1. Environmentally friendly with low odor, provides good workability, and fast curing time

2. The working time can be adjusted according to customer requirements to enhance installation and delivery efficiency

Application Scenarios:Suitable for bonding plastic/polymer sheets to the base

Product characteristics:

1.Offers excellent bonding strength, easy low-temperature debonding, and high cost performance

2.Compatible with both manual and automated adhesive application processes

Application Scenarios：Applicable to the splicing of short rods prior to silicon rod squaring

Product characteristics:

1.Features quick positioning, rapid curing, high strength, and easy debonding.

2.Compatible with both manual and automated processes.

Application Scenarios:Suitable for bonding silicon blocks to the base plate.

Product characteristics:

1. Offers excellent fluidity, high strength, high yield, and easy debonding. 

2. Adaptable to various slicing processes and silicon wafer sizes.

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Application Scenarios:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass

Product characteristics:

1.High bonding strength, no flow, fast curing speed, no damage to the surface of the substrate. 

2. East debonding

'=='')}Application Scenarios:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass.{else}

Application Scenarios:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass

Product characteristics:

1.High bonding strength, no flow, fast curing speed, no damage to the surface of the substrate. 

2. East debonding

{/pboot:if}