Application Area：Suitable for temporary fixing and bonding of photovoltaic silicon wafers

Features & Benefits：

1. Easy to debond with high bonding strength

2. Compatible with both automatic and manual dispensing processes

Application Area: Suitable for photovoltaic module encapsulation.

Features & Benefits:

1.Excellent weather resistance

2.High bonding strength

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Application Area:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass

Features & Benefits:

1.High bonding strength, no flow, fast curing speed, no damage to the surface of the substrate. 

2. East debonding

'=='')}Application Scenarios:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass.{else}

Application Area:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass

Features & Benefits:

1.High bonding strength, no flow, fast curing speed, no damage to the surface of the substrate. 

2. East debonding

{/pboot:if}