Applcation Scenarios： Suitable for encapsulation of HJT, thin-film, perovskite, and other photovoltaic modules.

Product characteristics:

1. Offers superior insulation and moisture barrier properties. 

2. Noted for its excellent aging stability.

Application Scenarios:Suitable for bonding plastic/polymer sheets to the base

Product characteristics:

1.Offers excellent bonding strength, easy low-temperature debonding, and high cost performance

2.Compatible with both manual and automated adhesive application processes

Application Scenarios：Applicable to the splicing of short rods prior to silicon rod squaring

Product characteristics:

1.Features quick positioning, rapid curing, high strength, and easy debonding.

2.Compatible with both manual and automated processes.

Application Scenarios:Suitable for bonding silicon blocks to the base plate.

Product characteristics:

1. Offers excellent fluidity, high strength, high yield, and easy debonding. 

2. Adaptable to various slicing processes and silicon wafer sizes.

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Application Scenarios:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass

Product characteristics:

1.High bonding strength, no flow, fast curing speed, no damage to the surface of the substrate. 

2. East debonding

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Application Scenarios:Applicable to bonding and fixing of silicon rod, sapphire, NdFeB, ceramic and optical glass

Product characteristics:

1.High bonding strength, no flow, fast curing speed, no damage to the surface of the substrate. 

2. East debonding

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Application Scenarios:Ideal for sealing photovoltaic aluminum frames, glass, TPT/TPE backplanes, and junction boxes.

Product characteristics:

1.Characterized by its rapid curing speed, robust stability, and environmentally friendly emissions  during curing, meeting the demands of automated production lines. 

2. Exhibits excellent resistance to extreme temperatures and weather conditions, along with strong  adhesive properties.